Power Modules

A fossil fuel free future requires tremendous electrification. Power modules are getting remarkably hot due to increasing power ratings and miniaturization. So hot, in fact, de-rating is needed to prevent overheating.

The Status Quo
vs. Carbice

  • New chip technology
  • More power density
  • Faster switching speed
  • Smaller footprint
  • Liquid TIMs
  • Overheating
  • Dynamic interface
  • Harsher environment
  • Liquid TIMs degrade
  • Shorter lifespan
  • Liquid TIM
  • Excess material
  • Higher tool investment
  • Shorter lifespan
  • Higher cost
  • Pervasive TIMs
  • Excess material waste
  • Shorter device lifespan
  • Hard to recycle
  • More emission & waste
  • Liquid TIMs
  • Higher temp ICs
  • Dynamic interface
  • Require baseplate
  • Larger cooling system
  • Bulky device & performance derate
  • Liquid TIMs
  • Messy process
  • Degrades over time
  • Require onsite stencil process
  • Painful experience
Best-in-class thermal conductivity, lowest lifetime thermal resistance, and stability through cycling. Carbice® Ice Pad removes heat from power modules more efficiently & reliably.
Provide best performance with no loss over time, in any environment. This means longer lifetime, higher reliability and no derating for power modules.
Industry leading shelf life eliminates excess material waste. Ease of use reduces labor hours and manufacturing cost for assembly and rework. Ready for automation to optimize assembly in manufacturing.
Built to last from recycled Al and waste gas, minimizes material and secondary waste through precise sizing and a clean process. Simulation based on real physics of the interfaces allows you to design and test with less waste.
Carbice Ice Pad provides high thermal performance, reliable over time and cycle, reduces cooling system's size and weight, and enables all power modules, with or without a baseplate
Clean and easy: Peel-n-stick the dry Carbice Pad to apply and rework. Can even come pre-applied. Saves time and resources.
Case Study
TIMs after 2000 cycles
Case Study
GPU cooling
Case Study
TIMs after 2000 cycles

Ice Pad™ provides better long-term cooling than other TIMs

Electronic devices experience an increasing number of heat management challenges:

  • Smaller and more powerful electronics lead to thermal expansion mismatch
  • Thermal expansion mismatch causes electronic malfunction and shortens lifespan
  • Conventional TIMs fail to dissipate heat over time due to dry-out, pump-out, and formation of air voids
  • Electronics de-rate, degrade, and are disposed as e-waste after a short time

High-Performance Grease C-SAM Analysis
Grease was applied only at the center of the interface (within the dotted circle).

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

After only ~50 cycles, the grease has completely dried out.

High-Performance PCM C-SAM Analysis
PCM was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

Air voids migrate around interface with PCM.

Carbice Ice Pad C-SAM Analysis
Ice Pad IP150 was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

Ice Pad cause no interface degradation throughout the 2000 test cycles. 


Coupon thermal resistance change due to thermal cycling


Thermal cycling performed from -55 °C to 110 °C for 2000 cycles, according to modified JEDEC standard JESD22-A104F condition L. Thermal conductance measured using ASTM D5470 standard testing method.

Thermal interface quality degrades with increasing cycles for conventional TIMs:

  • After 2000 cycles the thermal resistance of grease is 2.6 times that of Ice Pad
  • After 2000 cycles the thermal resistance of PCM is 1.4 times that of Ice Pad

Using Ice Pad, customers are able to:

  • Remove heat effectively and reliably over time
  • Expect less de-rating of electronics over time
  • Build higher performance electronics that last longer
  • Generate less e-waste and be more sustainable
Case Study
GPU cooling

Ice Pad enables better cooling for GPU

The challenge of GPU heat management

GPUs are incorporated by data centers to handle increasingly intensive workloads:

  • They are affected by large thermal variances during operation
  • Heat buildup reduces GPU’s performance, stability and lifespan
  • Reliability of data centers will be compromised

Meet Ice Pad

Ice Pad provides high thermal conductivity of a solid TIM and low thermal resistance of a liquid TIM, with reliable long-term performances and high volume manufacturability. For this study, we used IP90 with 2-sided assembly tack.

Carbice Ice Pad demonstrated immediate better cooling and long-term gains to GPU performance compared to POR Grease:

  • 2℃ cooler upon initial installation
  • > 6℃ cooler after extended use

Over time, grease pumps-out and develops dry-cracks, causing its thermal resistance to double after extended use. On the contrary, Carbice Ice Pad wets the interface even better with time and cycling.

Ice Pad provides better lifetime cooling performance than grease.


Using Carbice Ice Pad, customers are able to:

  • Lower GPU temperature 
  • Boost GPU performance
  • Extend GPU lifespan 
  • Increase data center reliability
Carbice is nothing short of revolutionary and will completely disrupt thermal management in every industry.
Receive the latest updates and news from Carbice
Your email
Please use a valid email.