Carbice® Pad Carbice<sup>®</sup> Pad Icon

The no-compromise TIM delivering best-in-class performance for both small and large surface area cooling.
AS9100D & ISO9001 Certified
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Case Study
TIMs after 2000 cycles
Case Study
GPU cooling
Case Study
TIMs after 2000 cycles

Carbice® Pad provides better long-term cooling than other TIMs

Electronic devices experience an increasing number of heat management challenges:

  • Smaller and more powerful electronics lead to thermal expansion mismatch
  • Thermal expansion mismatch causes electronic malfunction and shortens lifespan
  • Conventional TIMs fail to dissipate heat over time due to dry-out, pump-out, and formation of air voids
  • Electronics de-rate, degrade, and are disposed as e-waste after a short time

High-Performance Grease C-SAM Analysis
Grease was applied only at the center of the interface (within the dotted circle).

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

Takeaway:
After only ~50 cycles, the grease has completely dried out.
 


High-Performance PCM C-SAM Analysis
PCM was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

Takeaway:
Air voids migrate around interface with PCM.
 


Carbice Pad C-SAM Analysis
Carbice Pad IP150 was applied over the entire interface.

Initial install
After 50 cycles
After 2,000 cycles
Inspection after disassembly

Takeaway:
Carbice Pad cause no interface degradation throughout the 2000 test cycles. 

 

Coupon thermal resistance change due to thermal cycling
 

 

Thermal cycling performed from -55 °C to 110 °C for 2000 cycles, according to modified JEDEC standard JESD22-A104F condition L. Thermal conductance measured using ASTM D5470 standard testing method.

Thermal interface quality degrades with increasing cycles for conventional TIMs:

  • After 2000 cycles the thermal resistance of grease is 2.6 times that of Carbice Pad
  • After 2000 cycles the thermal resistance of PCM is 1.4 times that of Carbice Pad
     

Using Carbice Pad, customers are able to:

  • Remove heat effectively and reliably over time
  • Expect less de-rating of electronics over time
  • Build higher performance electronics that last longer
  • Generate less e-waste and be more sustainable
Case Study
GPU cooling

Carbice® Pad enables better cooling for GPU

The challenge of GPU heat management

GPUs are incorporated by data centers to handle increasingly intensive workloads:

  • They are affected by large thermal variances during operation
  • Heat buildup reduces GPU’s performance, stability and lifespan
  • Reliability of data centers will be compromised
     

Meet Carbice Pad

Carbice Pad provides high thermal conductivity of a solid TIM and low thermal resistance of a liquid TIM, with reliable long-term performances and high volume manufacturability. For this study, we used IP90 with 2-sided assembly tack.

Carbice Pad demonstrated immediate better cooling and long-term gains to GPU performance compared to POR Grease:

  • 2℃ cooler upon initial installation
  • > 6℃ cooler after extended use

Over time, grease pumps-out and develops dry-cracks, causing its thermal resistance to double after extended use. On the contrary, Carbice Pad wets the interface even better with time and cycling.
 

Takeaway:
Carbice Pad provides better lifetime cooling performance than grease.

 

Using Carbice Pad, customers are able to:

  • Lower GPU temperature 
  • Boost GPU performance
  • Extend GPU lifespan 
  • Increase data center reliability
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