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Semiconductor Test

It’s become increasingly difficult to manage the heat encountered during IC tests. Absent the proper mitigations, it’s easy to generate so much heat that chips can literally burn up. In addition, these thermal interfaces must be able to handle repeated use with minimal wear.

The Status Quo
vs. Carbice

THERMAL MANAGEMENT PERFORMANCE
RELIABILITY
COST OF OWNERSHIP REDUCTION
SUSTAINABILTY
DESIGN INNOVATION
STATUS QUO
  • More testing power
  • Faster testing speeds
  • Smaller dies
  • No sufficient TIM
  • Overheating
  • Chip stains w TIM
  • Chip mars w/o TIM
  • TIM generates debris
  • Chip fails with temp overshoot
  • Unreliable test & chip yield loss
  • No sufficient TIM
  • Bigger heat sinks
  • Temp overshoot
  • More chip yield loss
  • Higher costs
  • No sufficient TIM
  • Chip damage from test
  • Frequent change-outs
  • Longer heating and cooling
  • More emission & waste
  • No sufficient TIM
  • Narrows temp range
  • Lowers testing speed
  • Reduces chip yield
  • Requires pedestals
  • Limits testing system
CARBICE
Provides reliable heat dissipation over broad temperature range (-55 – 175°C) and pressure range (2.5 – 150 psi). Fast response minimizes temperature overshoot of small dies. Verified performance consistency over 1 million make/break testing cycles.
Carbice® Pads don’t stain chips or create debris. Carbice Nanotube forest acts as a shock absorber to protect chips from marring. Carbice Pads maintain reliable thermal performance and structural integrity over 1 million make/break testing cycles.
Stable over the entire temperature range, allow repeated make/break. Resulting increase in chip production throughput and reduced chip yield loss from temperature overshoot lowers cost.
Built to last, from recycled Al and waste gas, reusable and recyclable. More insertion cycles with Carbice Pad™ means less material waste and a more responsible & sustainable solution.
Enables the full temperature range of a tester allowing innovative system design. Shock absorption capability protects chip damage and eliminates the need for pedestals.
Advanced thermal interface materials are becoming a critical component to achieve performance and secure the supply chain.
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