The latest Data Center Dynamics Cooling Supplement issue, “Strategies for Effective Cooling,” takes a deep dive into one of the most overlooked challenges in modern data centers: the hidden inefficiencies caused by today’s thermal interface materials.
In the feature story on Carbice (pages 7–9), DCD highlights how carbon-nanotube-based interfaces are emerging as a breakthrough solution for operators struggling with rising chip power, uneven thermals, and reliability risks at scale.
Carbice addresses one of the industry’s most persistent issues: the unpredictability and mechanical instability of legacy thermal interface materials. As AI hardware climbs past new power thresholds, traditional TIMs are becoming incapable of providing dependable performance. Carbice’s engineered CNT interface offers consistent thermal performance, mechanical compliance, and long-term reliability that aligns with the needs of next-generation data center deployments.
Dive Deeper Into the Future of Cooling
If you’re looking to understand why so many operators, OEMs, and system integrators are rethinking the thermal interface layer—and why consistent, predictable cooling is becoming a strategic advantage, this article is essential reading.
